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NXP Semiconductors
IP4242CZ6
ESD protection for high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
1
Symbol
TMDS_CH1 ?
Description
negative channel 1 ESD protection
Simpli?ed outline
Graphic symbol
2
TMDS_CH1+
positive channel 1 ESD protection
1
2
3
1
2
3
4
5
GND
GND
n.c.
ground
ground
not connected
6
n.c.
not connected
6 5
bottom view
4
3, 4
001aaj776
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4242CZ6
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 × 1.45 × 0.5 mm
4. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
V I
input voltage
GND ? 0.5 +5.5
V
V esd
electrostatic discharge
all pins to ground;
? 8
+8
kV
voltage
IEC 61000-4-2, level 4;
contact discharge
T stg
T amb
storage temperature
ambient temperature
? 55
? 40
+125
+85
° C
° C
5. Characteristics
Table 4.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
V BRzd
I LRzd
V F
C ch(TMDS)
Zener diode breakdown voltage
Zener diode reverse leakage current
forward voltage
TMDS channel capacitance
I = 1 mA
per TMDS channel; V = 3.0 V
f = 1 MHz; V bias = 2.5 V
[1]
[1]
6
-
-
-
-
-
0.7
0.9
9
1
-
-
V
μ A
V
pF
? C ch(TMDS)
TMDS channel capacitance difference f = 1 MHz; V bias = 2.5 V
[1]
-
0.15 -
pF
C ch(mutual)
mutual channel capacitance
between signal pin and pin n.c.;
[1]
-
0.15 -
pF
f = 1 MHz; V bias = 2.5 V
IP4242CZ6_1
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 12 March 2009
2 of 9
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